Manufacturing Process - Company Ranking(7 companies in total)
Last Updated： Aggregation Period:Aug 26, 2026〜Sep 22, 2026
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Characteristics】 ■Thickness [mm]: 0.03 ■Tensile Strength [MPa]: 205 ■Elongation [%]: 50 ■Surface Roughness (Rmax) [um]: 0.5～1 ■Ther... | 【Purpose】 ■ For semiconductor TCB (thermal compression bonding) process release ■ Prevention of chip damage ■ Prevention of contamination of... | ||
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Nitto L Materials
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- Featured Products
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Semiconductor manufacturing process TCB {Thermal Compression Bonding} release film "HR-S051"
- overview
- 【Characteristics】 ■Thickness [mm]: 0.03 ■Tensile Strength [MPa]: 205 ■Elongation [%]: 50 ■Surface Roughness (Rmax) [um]: 0.5～1 ■Ther...
- Application/Performance example
- 【Purpose】 ■ For semiconductor TCB (thermal compression bonding) process release ■ Prevention of chip damage ■ Prevention of contamination of...
-
Nitto L Materials
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